Additive quantification in a commercial CMP sample

Chemical mechanical polishing (CMP) or planarization slurries are used in the semiconductor industry to create a specific surface on a silicon wafer in the construction of various electronics. To maintain the quality of the slurry, many chemical additives are used. The routine analysis of additives in a CMP slurry can be helpful in formulation or quality control.

Using a fifteen-minute separation method, the Waters Arc High Performance Liquid Chromatography (HPLC) system with Photodiode Array (PDA) and ACQUITY QDa Mass Detection (MS) can be used for analysis of a CMP slurry and for individual additives or mixtures of additives in a quantitative analysis for those easily detected by PDA, and a qualitative analysis for those more challenging additives that require mass detection.

In this free application note:

• Learn how the Arc HPLC system can rapidly quantify additives without re-validation
• Discover the robust XBridge BEH columns that are capable of low and high-pressure applications without compromising the column bed
• Find out how ACQUITY QDa Mass Detection can give you more confidence in your results
• Explore the Empower 3 Chromatography Data System (CDS) for data analysis of PDA, QDa, and all Waters Arc HPLC compatible detectors