Application note: Additive quantification in a commercial CMP sample

Chemical mechanical polishing (CMP) or planarization slurries are used in the semiconductor industry to create a specific surface on a silicon wafer in the construction of various electronics. To maintain the quality of the slurry, many chemical additives are used. Analytical methods are needed to ensure the quality of a CMP slurry, and most methods require complicated sample preparation and multiple techniques to achieve results. Arc HPLC with PDA and ACQUITY QDa Detector is a simple and routine analysis option.

This application note offers an experimentally-demonstrated, fifteen minute routine method for the analysis of known CMP slurry additives with minimal sample prep. Download now to learn more about…

• Using the Arc HPLC system with a routine separation method that is capable of in-system method update to quantification of additives using HPLC with Photodiode Array and Mass Detection UHPLC without re-validation
• The robust XBridge BEH columns capable of low and high-pressure applications without compromising the column bed
• Gaining more confidence in your assay results with ACQUITY QDa Mass Detection
• Using the Empower 3 Chromatography Data System (CDS) for data analysis of PDA, QDa, and all Waters Arc HPLC compatible detectors